PCB Gold Plating
PCB Gold Plating
Applications & Processes

Plating a thin layer of nickel, tin, gold or alloy coating on electronics parts improves the electrical conductivity. For example the Ni/Au plating process is utilized in the PCB industry to improve the electrical performance of contact area with the purpose to obtain a low electrical contact resistance; good wear resistance and protection against oxidation (corrosion). 


MAGNETO can supply both Platinised anodes and Iridium Mixed Metal Oxide (MMO) coated Titanium anodes. The optimum anode coating depends on the client specific application requirements. Platinised anodes supplied by MAGNETO is already being widely used in these processes by various major manufacturers.

Superiority
  • Stable performance and long functional lifetime
  • Low bath voltage and homogeneous current distribution
  • Environmentally friendly
  • Lower total cost
Application Conditions
  • Electrolyte
    Acidic / Cyanide system, brighteners & other additives
    Au: 4-10g/l
    CN: low concentration
    pH: 4-5
  • Temperature
    40°C-60°C
  • Current Density
    0.1-1.0ASD, 0.2ASD in average
  • Anode Type
    • Ir MMO coated anode
    • Platinum coated titanium anode for electroplating with the platinum thickness of 1μm-10μm, or even thicker
  • Characteristics
    • Suitable for PCB Gold and alloy plating process
    • Pt/MMO Composite Coatings for Platinised anodes
    • Both Platinised anodes and Iridium MMO coated anodes can be selected and modified according to client's application specific requirements
  • Products & Services
    New anode manufacture and recoating of used anodes
PCB Gold Plating PCB Gold Plating