As one of the basic materials of electronic industry, electrolytic copper foil is mainly used to manufacture printed circuit board (PCB) and lithium-ion battery, and widely used in home appliances, communication, computing (3C), and new energy industry, etc. In recent years, more stringent and newer requirements are proposed for copper foil with the development of 5G technology and lithium battery industry. Very low profile (VLP) copper foil for 5G and ultra-thin copper foil for lithium battery dominate the new development direction of copper foil technology.

Insoluble titanium anodes for electrolytic copper foils are divided into insoluble anodes for foil production and insoluble anodes for post-treatment process, among which insoluble anodes for foil production are divided into back-pulled segment anodes and embedded plum blossom hole sleeve anodes.

Although the insoluble anode has different shapes, the manufacturing process is generally the same. The titanium substrate and precious metal solution are the main raw materials, and the precious metal solution is uniformly coated on the titanium substrate through the coating process and repeatedly sintered at high temperatures. The anode is equipped with very high electrochemical stability, excellent electrochemical catalytic performance, and long-lasting service life. It provides technological safeguards to produce standard copper foils and lithium-ion copper foils.